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Home
Memory
> EEPROMs
Results:
10 Remaining
Manufacturer Part Number
5962-8852508XA
5962-8863403YA
AT28BV64-30TI
AT28C256E-20TI
AT28LV64-20TC
HN58C1001FP-15
HN58C256AFP-85
HN58V65AFP-10
HN58V65AFPI-10
XQ18V04VQ44N
XQ17V16CC44M
XC17256DDD8M
W27C512P-70
W27C512P-45
W27C010P-70
MT29F8G08ABACAWP-IT
M5M28C64AVP-15
K8P5615UQA-PI4DT
IS93C46-3G
IS24C32A-2ZLI
IS24C32A-2GLI
IS24C08A-2ZLI-TR
IS24C08A-2ZLI
IS24C04A-3PI
Pbfree Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Active
Ihs Manufacturer
ATMEL CORP
HITACHI LTD
XILINX INC
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
MITSUBISHI ELECTRIC CORP
SAMSUNG SEMICONDUCTOR INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
DIP
QFJ
TSOP1
TSOP
SOIC
QFP
LCC
TSSOP
Package Description
DIP, DIP28,.6
QCCN, LCC32,.45X.55
TSSOP, TSSOP28,.53,22
TSOP1, TSSOP28,.53,22
SOP, SOP32,.56
SOP, SOP28,.45
PLASTIC, VQFP-44
CERAMIC, LCC-44
CERAMIC, DIP-8
0.330 INCH, PLASTIC, LCC-32
PLASTIC, LCC-32
LEAD FREE, PLASTIC, TSOP1-48
8 X 13.40 MM, PLASTIC, TSOP1-28
TSSOP, TSSOP56,.8,20
SOP, SOP8,.25
TSSOP, TSSOP8,.25
3 X 4.40 MM, GREEN, MO-153AA, TSSOP-8
TSOP1, TSSOP8,.25
DIP, DIP8,.3
Pin Count
28
32
44
8
Reach Compliance Code
compliant
unknown
not_compliant
ECCN Code
3A001.A.2.C
EAR99
3A991.B.1.B.2
HTS Code
8542.32.00.51
8542.32.00.71
Manufacturer
Atmel Corporation
Hitachi Ltd
Xilinx
Winbond Electronics Corp
Micron Technology Inc
Mitsubishi Electric
Samsung Semiconductor
Integrated Silicon Solution Inc
Risk Rank
5.87
5.28
5.74
5.63
5.76
5.59
5.8
5.47
5.46
5.7
5.75
5.83
5.9
5.73
5.78
5.84
5.81
5.55
5.79
5.33
Access Time-Max
150 ns
90 ns
300 ns
200 ns
85 ns
100 ns
20 ns
70 ns
45 ns
Command User Interface
NO
YES
Data Polling
YES
Data Retention Time-Min
10
20
100
Endurance
100000 Write/Erase Cycles
10000 Write/Erase Cycles
20000 Write/Erase Cycles
1000000 Write/Erase Cycles
JESD-30 Code
R-GDIP-T28
R-CQCC-N32
R-PDSO-G28
R-PDSO-G32
S-PQFP-G44
S-CQCC-J44
R-GDIP-T8
R-PQCC-J32
R-PDSO-G48
R-PDSO-G56
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e0
e6
e3
Length
37.215 mm
13.95 mm
11.8 mm
20.45 mm
18.3 mm
10 mm
16.51 mm
10.16 mm
13.97 mm
18.4 mm
4.4 mm
4.9 mm
9.325 mm
Memory Density
262144 bit
65536 bit
1048576 bit
4194304 bit
16777216 bit
524288 bit
8589934592 bit
268435456 bit
1024 bit
32768 bit
8192 bit
4096 bit
Memory IC Type
EEPROM
CONFIGURATION MEMORY
EEPROM CARD
Memory Width
8
1
16
Number of Functions
1
Number of Words
32768 words
8192 words
131072 words
524288 words
2097152 words
262144 words
65536 words
1073741824 words
16777216 words
64 words
4096 words
1024 words
512 words
Number of Words Code
32000
8000
128000
512000
2000000
256000
64000
1000000000
16000000
64
4000
1000
512
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
70 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
32KX8
8KX8
128KX8
512KX8
2MX8
256KX1
64KX8
1GX8
16MX16
64X16
4KX8
1KX8
512X8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Equivalence Code
DIP28,.6
LCC32,.45X.55
TSSOP28,.53,22
SOP32,.56
SOP28,.45
TQFP44,.47SQ,32
LDCC44,.7SQ
DIP8,.3
LDCC32,.5X.6
TSSOP28,.46,20
TSSOP56,.8,20
SOP8,.25
TSSOP8,.25
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE
FLATPACK, THIN PROFILE
Page Size
64 words
128 words
32 words
Parallel/Serial
PARALLEL
PARALLEL/SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
240
225
260
Power Supplies
5 V
3/3.3 V
3.3 V
3/5 V
2.5/3.3 V
2/5 V
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
MIL-PRF-38535 Class Q
Seated Height-Max
5.72 mm
2.54 mm
1.2 mm
3 mm
2.5 mm
4.826 mm
5.08 mm
3.56 mm
1.73 mm
4.57 mm
Standby Current-Max
0.00035 A
0.06 A
0.00005 A
0.0002 A
0.00002 A
0.000005 A
0.02 A
0.001 A
0.0001 A
0.00006 A
0.00001 A
0.000001 A
0.000002 A
Subcategory
EEPROMs
Flash Memories
OTP ROMs
Supply Current-Max
0.08 mA
0.008 mA
0.05 mA
0.03 mA
0.025 mA
0.1 mA
0.01 mA
0.006 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
5.25 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
3 V
4.75 V
1.8 V
2.5 V
Technology
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb) - hot dipped
Tin/Lead (Sn/Pb)
Tin/Lead (Sn85Pb15)
TIN LEAD
Tin/Bismuth (Sn97Bi3)
Matte Tin (Sn) - annealed
Terminal Form
THROUGH-HOLE
NO LEAD
GULL WING
J BEND
Terminal Pitch
2.54 mm
1.27 mm
0.5 mm
0.55 mm
0.8 mm
0.65 mm
Terminal Position
DUAL
QUAD
Width
15.24 mm
11.4 mm
8 mm
11.3 mm
8.4 mm
7.62 mm
11.43 mm
12 mm
3 mm
3.9 mm
Write Cycle Time-Max (tWC)
10 ms
3 ms
5 ms
Rohs Code
No
Yes
Output Characteristics
3-STATE
Package Code
QCCN
TSSOP
TSOP1
SOP
TQFP
QCCJ
Additional Feature
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION
AUTOMATIC WRITE
100K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS
10K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS
100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION
100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SOFTWARE DATA PROTECTION; 32 BYTE PAGE WRITE
100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SOFTWARE DATA PROTECTION; 64 BYTE PAGE WRITE
TTL/CMOS COMPATIBLE INPUT & OUTPUT
PAGE WRITE
Moisture Sensitivity Level
3
1
Programming Voltage
3 V
12 V
2.7 V
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
40
Supply Voltage-Nom (Vsup)
3.3 V
3.6 V
3 V
2.5 V
5 V
Clock Frequency-Max (fCLK)
20 MHz
33 MHz
12 MHz
0.5 MHz
1 MHz
Surface Mount
YES
NO
Total Dose
40k Rad(Si) V
Type
NOR TYPE
I/O Type
COMMON
Factory Lead Time
3 Weeks
Number of Terminals
48
56
Boot Block
BOTTOM/TOP
Number of Sectors/Size
8,126
Sector Size
32K,128K
Serial Bus Type
MICROWIRE
I2C
Write Protection
SOFTWARE
HARDWARE
I2C Control Byte
1010DDDR
1010DMMR
1010DDMR
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Price
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Mfr.Part#
Manufacturers
Product Category
Package
PDF
XQ18V04VQ44N
Price:
Call
In Stock:
On Order
Description:
Configuration Memory， 512KX8， Parallel/serial， CMOS， PQFP44， PLASTIC， VQFP-44
Mfr.Part#:
XQ18V04VQ44N
Manufacturers:
Xilinx
Category:
EEPROMs
Package:
PLASTIC, VQFP-44
PDF:
N/A
XQ17V16CC44M
Price:
Call
In Stock:
On Order
Description:
Configuration Memory， 2MX8， 20ns， Parallel/serial， CMOS， CQCC44， CERAMIC， LCC-44
Mfr.Part#:
XQ17V16CC44M
Manufacturers:
Xilinx
Category:
EEPROMs
Package:
CERAMIC, LCC-44
PDF:
N/A
XC17256DDD8M
Price:
Call
In Stock:
On Order
Description:
256KX1 CONFIGURATION MEMORY， CDIP8， CERAMIC， DIP-8
Mfr.Part#:
XC17256DDD8M
Manufacturers:
Xilinx
Category:
EEPROMs
Package:
CERAMIC, DIP-8
PDF:
N/A
W27C512P-70
Price:
Call
In Stock:
On Order
Description:
EEPROM， 64KX8， 70ns， Parallel， CMOS， PQCC32， 0.330 INCH， PLASTIC， LCC-32
Mfr.Part#:
W27C512P-70
Manufacturers:
Winbond
Category:
EEPROMs
Package:
0.330 INCH, PLASTIC, LCC-32
PDF:
N/A
W27C512P-45
Price:
Call
In Stock:
On Order
Description:
EEPROM， 64KX8， 45ns， Parallel， CMOS， PQCC32， 0.330 INCH， PLASTIC， LCC-32
Mfr.Part#:
W27C512P-45
Manufacturers:
Winbond
Category:
EEPROMs
Package:
0.330 INCH, PLASTIC, LCC-32
PDF:
N/A
MT29F8G08ABACAWP-IT-C
Price:
Call
In Stock:
On Order
Description:
EEPROM Card， 1GX8， Parallel， CMOS， PDSO48， LEAD FREE， PLASTIC， TSOP1-48
Mfr.Part#:
MT29F8G08ABACAWP-IT:C
Manufacturers:
Micron
Category:
EEPROMs
Package:
LEAD FREE, PLASTIC, TSOP1-48
PDF:
N/A
HN58V65AFP-10
Price:
Call
In Stock:
On Order
Description:
EEPROM， 8KX8， 100ns， Parallel， CMOS， PDSO28， 0.400 INCH， PLASTIC， SOP-28
Mfr.Part#:
HN58V65AFP-10
Manufacturers:
Hitachi
Category:
EEPROMs
Package:
SOP, SOP28,.45
PDF:
N/A
HN58C256AFP-85
Price:
Call
In Stock:
On Order
Description:
EEPROM， 32KX8， 85ns， Parallel， CMOS， PDSO28， 0.400 INCH， PLASTIC， SOP-28
Mfr.Part#:
HN58C256AFP-85
Manufacturers:
Hitachi
Category:
EEPROMs
Package:
SOP, SOP28,.45
PDF:
N/A
HN58C1001FP-15
Price:
Call
In Stock:
On Order
Description:
EEPROM， 128KX8， 150ns， Parallel， CMOS， PDSO32， 0.525 INCH， PLASTIC， SOP-32
Mfr.Part#:
HN58C1001FP-15
Manufacturers:
Hitachi
Category:
EEPROMs
Package:
SOP, SOP32,.56
PDF:
N/A
5962-8863403YA
Price:
Call
In Stock:
On Order
Description:
EEPROM， 32KX8， 90ns， Parallel， CMOS， CQCC32， CERAMIC， LCC-32
Mfr.Part#:
5962-8863403YA
Manufacturers:
Atmel (Microchip Technology)
Category:
EEPROMs
Package:
QCCN, LCC32,.45X.55
PDF:
N/A
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