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Manufacturer Part Number

Part Life Cycle Code

Ihs Manufacturer

Part Package Code

TSOP1
TSSOP2

Package Description

Pin Count

Reach Compliance Code

ECCN Code

EAR99

HTS Code

8542.32.00.71

Manufacturer

Risk Rank

Access Time-Max

Additional Feature

JESD-30 Code

Length

Memory Density

Memory IC Type

MASK ROM

Memory Width

Number of Functions

Number of Words

Number of Words Code

Operating Mode

ASYNCHRONOUS

Operating Temperature-Max

70 °C

Operating Temperature-Min

-10 °C

Organization

Package Body Material

PLASTIC/EPOXY

Package Code

Package Shape

RECTANGULAR

Package Style

Parallel/Serial

PARALLEL

Qualification Status

Not Qualified

Seated Height-Max

1.2 mm

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

2.7 V
2.97 V

Supply Voltage-Nom (Vsup)

Surface Mount

Technology

MOS
CMOS

Temperature Grade

COMMERCIAL

Terminal Form

GULL WING

Terminal Pitch

Terminal Position

DUAL

Width

Rohs Code

JESD-609 Code

Package Equivalence Code

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

Standby Current-Max

Subcategory

MASK ROMs

Supply Current-Max

Terminal Finish

Alternate Memory Width

Number of Terminals

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